| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT29F4G08ABADAWP-IT:D | MICRON/美光 | TSOP-48 | 22+ | 16 | 2026-07-02 | |||
| K4F8E304HB-MGCJ | SAMSUNG/三星 | FBGA-200 | 22+ | 164 | 2026-07-02 | |||
| K4B2G1646F-BCMA | SAMSUNG/三星 | BGA-96 | 21+ | 34 | 2026-07-02 | |||
| CY7C1049DV33-10ZSXI | CYPRESS/赛普拉斯 | TSOP-44 | 22+ | 147 | 2026-07-02 | |||
| MT40A1G16TB-062E:F | MICRON/美光 | FBGA-96 | 23+ | 28 | 2026-07-02 | |||
| IS42S16160G-7TLI | ISSI/芯成 | TSOP-54 | 23+ | 2148 | 2026-07-02 | |||
| IS42S16160J-7TLI | ISSI/芯成 | TSOP-54 | 2215+ | 1649 | 2026-07-02 | |||
| THGBMFG6C1LBAIL | TOSHIBA/东芝 | FBGA-153 | 2321+ | 507 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| H9HCNNN8KUMLHR-NME | SKHYNIX/海力士 | BGA | 23+ | 127 | 2026-07-02 | |||
| K9F1G08U0D-SCB0 | SAMSUNG/三星 | TAOP-48 | 2223+ | 5 | 2026-07-02 | |||
| THGBM5G5A1JBAIR | TOSHIBA/东芝 | BGA | 24+ | 282 | 2026-07-02 | |||
| H26M41204HPR | SKHYNIX/海力士 | BGA | 23+ | 614 | 2026-07-02 | |||
| S29GL256S90TFI020 | SPANSION/飞索半导体 | TSOP-56 | 2319+ | 257 | 2026-07-02 | |||
| H26M52208FPR | SKHYNIX/海力士 | FBGA-153 | 2232+ | 1011 | 2026-07-02 | |||
| KLM8G1WEPD-B031 | SAMSUNG/三星 | FBGA-153 | 22+/24+ | 274 | 2026-07-02 | |||
| NT5TU32M16FG-AC | NANYA/南亚 | FBGA-84 | 22+ | 1812 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT40A512M16JY-083E:B | MICRON/美光 | FBGA-96 | 23+ | 112 | 2026-07-02 | |||
| MT47H128M8SH-25E:M | MICRON/美光 | FBGA-60 | 23+ | 725 | 2026-07-02 | |||
| K4A4G165WF-BCTD | SAMSUNG/三星 | FBGA-153 | 2222+ | 2039 | 2026-07-02 | |||
| W9864G6KH-6 | WINBOND/华邦 | TSOP-54 | 19+ | 523 | 2026-07-02 | |||
| MT47H128M16RT-25E IT:C | MICRON/美光 | FBGA-84 | 22+ | 17 | 2026-07-02 | |||
| W9412G6KH-5 | WINBOND/华邦 | TSOP-54 | 24+ | 174 | 2026-07-02 | |||
| W9751G6KB-25 | WINBOND/华邦 | FBGA-84 | 23+ | 6150 | 2026-07-02 | |||
| H5AN8G6NAFR-UHC | SKHYNIX/海力士 | FBGA-96 | 23+ | 53 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SDIN8DE2-16G | SANDISK/闪迪 | FBGA-153 | 2331+ | 169 | 2026-07-02 | |||
| K9GBG08U0A-SCB0 | SAMSUNG/三星 | TSOP-48 | 22+ | 25 | 2026-07-02 | |||
| JS28F128J3D75A | INTEL/英特尔 | TSOP-56 | 2044+ | 6 | 2026-07-02 | |||
| AT45DB161D-TU | ATMEL/爱特梅尔 | TSOP-28 | 1835+ | 895 | 2026-07-02 | |||
| W9425G6JH-5 | WINBOND/华邦 | TSOP-66 | 14+ | 858 | 2026-07-02 | |||
| MT48LC16M16A2P-7E:D | MICRON/美光 | TSOP-54 | 22+ | 391 | 2026-07-02 | |||
| W9816G6XH-6 | WINBOND/华邦 | TSOP-50 | 1526+ | 99 | 2026-07-02 | |||
| K6R4016V1D-UI10 | SAMSUNG/三星 | TSOP-44 | 22+ | 331 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MX29LV640EBTI-70G | MXIC/旺宏 | TSOP-48 | 23+ | 1106 | 2026-07-02 | |||
| MT29F2G08ABAEAH4-IT:E | MICRON/美光 | FBGA-63 | 17+ | 1229 | 2026-07-02 | |||
| S34ML01G100TFI000 | SPANSION/飞索半导体 | TSOP-48 | 2323+ | 527 | 2026-07-02 | |||
| MX29LV640ETTI-70G | MXIC/旺宏 | TSOP-48 | 2022+ | 103 | 2026-07-02 | |||
| MT29F8G08ABACAWP-IT:C | MICRON/美光 | TSOP-48 | 22+ | 763 | 2026-07-02 | |||
| MT29F4G08ABAEAWP-IT:E | MICRON/美光 | TSOP48 | 23+ | 282 | 2026-07-02 | |||
| KLM4G1FETE-B041 | SAMSUNG/三星 | FBGA-153 | 2236+ | 1882 | 2026-07-02 | |||
| MX30LF1G18AC-TI | MXIC/旺宏 | TSOP-48 | 22+ | 3554 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K4S281632F-TC75 | SAMSUNG/三星 | TSOP-54 | 15+ | 686 | 2026-07-02 | |||
| HY57V561620FTP-H | SKHYNIX/海力士 | TSOP-54 | 3 | 142 | 2026-07-02 | |||
| MT41J128M16HA-125:D | MICRON/美光 | FBGA-96 | 22+ | 581 | 2026-07-02 | |||
| SST39VF800A-70-4I-EKE | SST/超捷 | TSOP-48 | 2012+ | 796 | 2026-07-02 | |||
| K9F1208U0B-PCB0 | SAMSUNG/三星 | TSOP-48 | 23+ | 173 | 2026-07-02 | |||
| H27UCG8T2ATR-BC | SKHYNIX/海力士 | TSOP-48 | 1942+ | 143 | 2026-07-02 | |||
| MT48LC32M16A2P-75IT:C | MICRON/美光 | TSOP-54 | 2434+ | 500 | 2026-07-02 | |||
| JS28F00AM29EWH | INTEL/英特尔 | TSOP-56 | 1826+ | 797 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| IS62WV5128BLL-55HLI | ISSI/芯成 | TSOP | 2316+ | 373 | 2026-07-02 | |||
| IS61WV25616BLL-10TLI | ISSI/芯成 | TSOP-44 | 19+ | 58 | 2026-07-02 | |||
| IS62WV25616BLL-55TLI | ISSI/芯成 | TSOP-44 | 23+ | 1870 | 2026-07-02 | |||
| IS61WV102416BLL-10TLI | ISSI/芯成 | TSOP-48 | 2213+ | 8 | 2026-07-02 | |||
| IS62WV51216EBLL-45TLI | ISSI/芯成 | TSOP-44 | 23+ | 143 | 2026-07-02 | |||
| IS62WV12816BLL-55TLI | ISSI/芯成 | TSOP-44 | 2025+ | 327 | 2026-07-02 | |||
| IS61LV25616AL-10TLI | ISSI/芯成 | TSOP-44 | 2330+ | 1880 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| H26M41208HPR | SKHYNIX/海力士 | FBGA-153 | 23+ | 143 | 2026-07-02 | |||
| MTFC8GAKAJCN-1M WT | MICRON/美光 | FBGA-153 | 23+ | 583 | 2026-07-02 | |||
| MTFC4GACAJCN-4M IT | MICRON/美光 | FBGA-153 | 22+ | 462 | 2026-07-02 | |||
| THGBMFG7C1LBAIL | TOSHIBA/东芝 | BGA | 21+ | 39 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| IS42S16160G-7TLI | ISSI/芯成 | TSOP-54 | 23+ | 2148 | 2026-07-02 | |||
| IS42S16160J-7TLI | ISSI/芯成 | TSOP-54 | 2215+ | 1649 | 2026-07-02 | |||
| CY7C1049DV33-10ZSXI | CYPRESS/赛普拉斯 | TSOP-44 | 22+ | 147 | 2026-07-02 | |||
| MT40A1G16TB-062E:F | MICRON/美光 | FBGA-96 | 23+ | 28 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K9GAG08U0E-SCB0 | SAMSUNG/三星 | TSOP-48 | 21+ | 22 | 2026-07-02 | |||
| M29W640GB70NA6E | ST/意法 | TSOP-48 | 2223+ | 1077 | 2026-07-02 | |||
| AT45DB321D-TU | ATMEL/爱特梅尔 | TSOP-28 | 2015+ | 297 | 2026-07-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K4F8E304HB-MGCJ | SAMSUNG/三星 | FBGA-200 | 22+ | 164 | 2026-07-02 | |||
| K4B2G1646F-BCMA | SAMSUNG/三星 | BGA-96 | 21+ | 34 | 2026-07-02 |
