| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K9GAG08U0E-SCB0 | SAMSUNG/三星 | TSOP-48 | 23+ | 37 | 2026-01-07 | |||
| K6R4008V1D-UI10 | SAMSUNG/三星 | TSOP-44 | 2327+ | 282 | 2026-01-07 | |||
| K4T51163QG-HCF7 | SAMSUNG/三星 | FBGA-84 | 18+ | 110 | 2026-01-07 | |||
| K9F1G08U0B-PCB0 | SAMSUNG/三星 | TSOP-48 | 1838+ | 1402 | 2026-01-07 | |||
| K9F2G08U0C-SCB0 | SAMSUNG/三星 | TSOP-48 | 2411+ | 383 | 2026-01-07 | |||
| K9F1208U0C-PCB0 | SAMSUNG/三星 | TSOP-48 | 22+ | 272 | 2026-01-07 | |||
| K9F4G08U0D-SCB0 | SAMSUNG/三星 | TSOP-48 | 20+ | 996 | 2026-01-07 | |||
| K4F8E304HB-MGCH | SAMSUNG/三星 | FBGA-200 | 23+ | 297 | 2026-01-07 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| THGBMHG8C4LBAIR | TOSHIBA/东芝 | FBGA-153 | 23+ | 198 | 2026-01-07 | |||
| CY62147EV30LL-45ZSXI | CYPRESS/赛普拉斯 | TSOP-44 | 22+ | 1580 | 2026-01-07 | |||
| THGBM4G4D1HBAIR | TOSHIBA/东芝 | FBGA-153 | 2231+ | 1069 | 2026-01-07 | |||
| KLMBG2JETD-B041 | SAMSUNG/三星 | FBGA-153 | 22+ | 617 | 2026-01-07 | |||
| THGBM5G6A2JBAIR | TOSHIBA/东芝 | FBGA-153 | 2230+ | 66 | 2026-01-07 | |||
| KLM8G1WEPD-B031 | SAMSUNG/三星 | FBGA-153 | 2337+ | 278 | 2026-01-07 | |||
| SDINBDG4-32G | SANDISK/闪迪 | FBGA-153 | 23+ | 13 | 2026-01-07 | |||
| S29GL032N90TFI040 | SPANSION/飞索半导体 | TSOP-48 | 1805+ | 15 | 2026-01-07 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SDIN7DU2-16G | SANDISK/闪迪 | FBGA-153 | 22+ | 131 | 2026-01-07 | |||
| MT48LC8M16A2P-75:G | MICRON/美光 | TSOP-54 | 22+ | 302 | 2026-01-07 | |||
| S29AL016J70TFI01 | SPANSION/飞索半导体 | TSOP-48 | 22+ | 419 | 2026-01-07 | |||
| K6R4008V1D-UI10 | SAMSUNG/三星 | TSOP-44 | 2327+ | 282 | 2026-01-07 | |||
| S34ML08G101TFI00 | SPANSION/飞索半导体 | TSOP-48 | 17+ | 76 | 2026-01-07 | |||
| K9F1G08U0B-PCB0 | SAMSUNG/三星 | TSOP-48 | 1838+ | 1402 | 2026-01-07 | |||
| K9F1208U0C-PCB0 | SAMSUNG/三星 | TSOP-48 | 22+ | 272 | 2026-01-07 | |||
| K9F4G08U0D-SCB0 | SAMSUNG/三星 | TSOP-48 | 20+ | 996 | 2026-01-07 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| H5PS1G63EFR-S5C | SKHYNIX/海力士 | FBGA-84 | 1831+ | 70 | 2026-01-07 | |||
| NAND256W3A2BN6 | ST/意法 | TSOP-48 | 1941+ | 693 | 2026-01-07 | |||
| HY57V561620FTP-H | SKHYNIX/海力士 | TSOP-48 | 19+ | 810 | 2026-01-07 | |||
| K4T51163QG-HCF7 | SAMSUNG/三星 | FBGA-84 | 18+ | 110 | 2026-01-07 | |||
| MT46V16M16P-5B:M | MICRON/美光 | TSOP-66 | 16+ | 430 | 2026-01-07 | |||
| W972GG6JB-25 | WINBOND/华邦 | FBGA-84 | 23+ | 240 | 2026-01-07 | |||
| H5TQ1G63EFR-H9C | SKHYNIX/海力士 | FBGA-96 | 23+ | 2659 | 2026-01-07 | |||
| H26M21001FPR | SKHYNIX/海力士 | FBGA-153 | 23+ | 188 | 2026-01-07 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SDINBDG4-8G | SANDISK/闪迪 | FBGA-153 | 23+ | 807 | 2026-01-07 | |||
| W29N01HVSINA | WINBOND/华邦 | TSOP-48 | 22+ | 296 | 2026-01-07 | |||
| KLMAG1JETD-B041 | SAMSUNG/三星 | FBGA-153 | 23+ | 738 | 2026-01-07 | |||
| KLM4G1FETE-B041 | SAMSUNG/三星 | FBGA-153 | 2236+ | 991 | 2026-01-07 | |||
| MBM29F080A-90PFTN | FUJITSU/富士通 | TSOP-48 | 1804+ | 96 | 2026-01-07 | |||
| MT29F4G08ABADAH4:D | MICRON/美光 | FBGA-63 | 23+ | 470 | 2026-01-07 | |||
| MX30LF1G18AC-TI | MXIC/旺宏 | TSOP-48 | 1937+ | 4136 | 2026-01-07 | |||
| MX29LV640ETTI-70G | MXIC/旺宏 | TSOP-48 | 2022+ | 203 | 2026-01-07 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| S29GL256N10TFI01 | SPANSION/飞索半导体 | TSOP-56 | 1805+ | 1655 | 2026-01-07 | |||
| TC58DVM92A5TAI0 | TOSHIBA/东芝 | TSOP-48 | 1311+ | 6 | 2026-01-07 | |||
| THGBMJG7C1LBAIL | TOSHIBA/东芝 | FBGA-153 | 2350+ | 278 | 2026-01-07 | |||
| S29GL512N11FFA02 | SPANSION/飞索半导体 | FBGA-64 | 2210+ | 366 | 2026-01-07 | |||
| THGBMJG6C1LBAIL | TOSHIBA/东芝 | FBGA-153 | 23+ | 212 | 2026-01-07 | |||
| TC58NVG0S3ETA00 | TOSHIBA/东芝 | TSOP-48 | 2241+ | 409 | 2026-01-07 | |||
| S29JL032J70TFI01 | SPANSION/飞索半导体 | TSOP-48 | 22+ | 341 | 2026-01-07 | |||
| SST39VF1602C-70-4I-EKE | SST/超捷 | TSOP-48 | 1139+ | 55 | 2026-01-07 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| S29JL032H70TFI02 | SPANSION/飞索半导体 | TSOP-48 | 22+ | 329 | 2026-01-07 | |||
| K9GAG08U0E-SCB0 | SAMSUNG/三星 | TSOP-48 | 23+ | 37 | 2026-01-07 | |||
| M29W640GB70NA6E | ST/意法 | TSOP-48 | 2223+ | 1166 | 2026-01-07 | |||
| NT5TU128M8GE-AC | NANYA/南亚 | FBGA-60 | 22+ | 586 | 2026-01-07 | |||
| RTL8363SB-CG | REALTEK/瑞昱 | QFP-128 | 23+ | 24 | 2026-01-07 | |||
| NAND01GW3B2BN6 | ST/意法 | TSOP-48 | 23+ | 14 | 2026-01-07 | |||
| AT91SAM9G25-CU | ATMEL/爱特梅尔 | BGA | 23+ | 962 | 2026-01-07 | |||
| AT45DB321D-TU | ATMEL/爱特梅尔 | TSOP-28 | 2015+ | 298 | 2026-01-07 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| W631GG6MB-12 | WINBOND/华邦 | FBGA-96 | 2028+ | 922 | 2026-01-07 | |||
| W9425G6KH-5 | WINBOND/华邦 | TSOP-66 | 2208+ | 82 | 2026-01-07 | |||
| W9825G6KH-6 | WINBOND/华邦 | TSOP-54 | 22+ | 1149 | 2026-01-07 | |||
| W9864G6KH-6 | WINBOND/华邦 | TSOP-54 | 19+ | 1182 | 2026-01-07 | |||
| W9812G6KH-6 | WINBOND/华邦 | TSOP-54 | 15+ | 2127 | 2026-01-07 | |||
| MT40A512M16JY-083E:B | MICRON/美光 | FBGA-96 | 23+ | 118 | 2026-01-07 | |||
| H5AN8G6NAFR-UHC | SKHYNIX/海力士 | FBGA-96 | 23+ | 107 | 2026-01-07 | |||
| IS42S16800F-7TLI | ISSI/芯成 | TSOP-54 | 20+ | 562 | 2026-01-07 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TC58BVG0S3HTA00 | TOSHIBA/东芝 | TSOP-48 | 18+ | 2796 | 2026-01-07 | |||
| SL811HST-AXC | CYPRESS/赛普拉斯 | TOFP48 | 22+ | 54 | 2026-01-07 | |||
| TVP7002PZPR | TI/德州仪器 | HTQFP-100 | 18+ | 356 | 2026-01-07 | |||
| TLV320AIC3101IRHBR | TI/德州仪器 | QFN-32 | 22+ | 10 | 2026-01-07 | |||
| LAN8720AI-CP-TR | MICROCHIP/微芯 | QFN-24 | 22+ | 97 | 2026-01-07 | |||
| ADV7842KBCZ-5 | ADI/亚德诺 | BGA-256 | 23+ | 48 | 2026-01-07 | |||
| CD74HC4511PWR | TI/德州仪器 | TSSOP-16 | 23+ | 4 | 2026-01-07 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| S29GL512N10TFI020 | SPANSION/飞索半导体 | TSOP-56 | 2346+ | 270 | 2026-01-07 | |||
| S29GL064N90TFI03 | SPANSION/飞索半导体 | TSOP-48 | 2134+ | 365 | 2026-01-07 | |||
| H5TC4G63AFR-11C | SKHYNIX/海力士 | FBGA-96 | 22+ | 291 | 2026-01-07 |